The Sr. Package Development Engineer will be responsible for the development, design and characterization of advaned packages for power semiconductors and electronic components for power conversion applications. Primary responsibilities include establishing the methodology for developing new package platforms and optimization of qualified packages for new products and multichip semiconductors, ICs and passive components. This will be achieved through the planning and execution of tactical and strategic projects to meet product and technology roadmaps. Working as an integral part of technology and product development project teams, working seamlessly with design centers, and engaging research institutions the senior package eng. is expected to bring vast semiconductor packaging expertise to the Semiconductor div. of our company. Anticipates and resolves materials and technical challenges with new products, including thermal and electrical efficiency, materials mismatch issues, adhesion, and manufacturing cost. This position also requires a contribution to innovative package concepts, mechanical design, and IP generation using a variety of packaging techniques based on metal frame, laminate or BGA.Roles & ResponsibilitiesDevelop and/or select packages for a single/multi-chip system in a package using high package density bare die components and ICs, as well as surface mount passive components.The final module also includes passives to complete the system. The tasks will be managed as projects for delivering qualifiable packages, which involve package design and layout, simulation, and characterizing of the final assembly, and risk management by characterizing sub-systems and power chips and reviewing vendor process and reliability data.Work with IC design teams, system design centers, program office and quality managers.Adapt knowledge of qualification procedures such as determination of, and tests to achieve, desired moisture level is a key requirement of this position.Work requires close technical relationships and engagement with customers, as well as with packaging partners to provide robust, low-cost, efficient packages.Contribution of innovative package designs and materials in conjunction with the development of technology Roadmaps.Be able to achieve this through keeping abreast of materials development, benchmarking, and close collaboration with Achitech, semiconductors and packaging.Candidate Qualification RequirementHands-on experience in package development position familiarity with automotive requirements is highly considered3-10 experience in Semiconductor packagingDemonstrated experience in package design using MCM, MLF, QFP/N, B/LGA, CSP, SO …Strong background in materials science and thermo-mechanical properties, and deep knowledge of the interactions of the material between semiconductors, die attachments, substrates, passivates and mold compoundsAbility to conduct failure analysis and determine root causeKnowledge of development and production using contract manufacturingFamiliarity with and hands-on experience in CAD simulation and modelingUnderstanding of device physicsGood knowledge of reliability and institutional (JEDEC, IPC …) requirements and proceduresBackground in project management
